This compact flat model 5-valve manifold is designed to accommodate any DIN19213 part 2 or Rosemount Integral mount style, instrument interface compliant differential or pressure transmitter. This manifold is usually fitted into a full glass reinforced polyester cabinet like CAB1/CAB2, full steel PS-1, PS1-D enclosure or BE1/BE2 Body Enclosure.

This manifold is standard produced in AISI316/L material, but “exotic” materials are also available.

Maximum working pressure is 420 Bar (AISI316)
Maximum temperature is 200°C (PTFE packing)


Per default: Vent and or Test ports will be 1/4” thread size. See ordering information on the back of this specification sheet for process port connection types available. Pitch between process ports: 54mm

Pressure vs. Temperature Diagram

Design features:

  • Self aligning metal seats
  • Compact Design
  • Non-rotating spindle tip
  • Metal seal between body and bonnet
  • Bonnet Locking pins
  • Safety back seating T-Bar and Anti-Tamper operated valves
  • Full traceability of all materials
  • 100% pressure tested (1,5 x MWP)


  • Anti tamper facility with a removable T-bar key to prevent unauthorized operation of the valve
  • Sour Gas Service
  • Mounting plates for 2” pipe stand
  • Available in e.g. Monel, Hastelloy, Duplex, Super Duplex, Alloy 825, Alloy 625 materials.
  • (NACE MR01-75 compliant)
  • Body enclosure and EEx manifold heater
  • High temperature up to 450°C (Graphite packing)
  • High pressure up to 680 Bar (10.000 psi)

Valve diagram


Measuring range
see data sheet
Measuring principal
OFCEAS laser
ambient temperature
10°C ... +40°C
Possible interfaces
Ethernet, ModBus (TCP/IP, RS), analog, USB
Power Supply
110–230V AC / 50–60 Hz
Analog outputs
4 ... 20mA; max. load 500Ω
Detection limit
see parameter
Respons time
< 10 sec
Dimensions (H x W x D)
Rack 19inch, 4U or cabinet
20 kg (analyzer)

The MD56F (Double Isolate, Double Equalize, Vent) is a ‘Flat model’ manifold, used for mounting Direct mounted differential pressure instruments in full enclosures and heated assemblies like the modular body enclosure(BE1&BE2), GRP enclosures and PS-1 full enclosure system.
optional: coplanar style transmitter facing